Manufacturing specifications

Capabilities for your design.

Explore our board materials, layer range, finishes and manufacturing limits. If your design has a special requirement, let’s talk it through.

Capability

Board manufacturing specifications

Base materialFR4, High Tg 170, PTFE, polyimide, Rogers, Aluminum back, Copper Back
Min/Max number of layers1–20 layers
Maximum board dimension17″ × 22″
Min/Max final board thickness.031″ – .125″
Starting copper foil thickness0.5 oz. – 4 oz.
Finished surfaceHASL, LF HASL, Immersion Silver, Gold Tab Plating, ENIG
Solder mask typesGlossy, Semi Gloss and Matte
Solder mask colorsGreen, Blue, Red, Black, Yellow and Clear
Plated copper thickness1 oz. – 3 oz.
Silkscreen minimum line width.006″
Silkscreen colorsWhite, Yellow, Black
Minimum line width.005″
Minimum drilled hole.010″
Aspect ratio1 to 6
V-score blade angles30, 60 and 90 degrees
CNC router minimum tool diameter.0276″
V-score depth for minimum thickness board.007″
Minimum trace distance to V-score.015″
Minimum slot width.0276″
Electrical testingGrid and Flying Probe, Golden board and NetList
Special capabilitiesCarbon Ink; Peelable Mask

Need a detail that isn’t listed? Please call us for a quote or send us your board requirements.